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    X11
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    SYS-1029TP-DC0R
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    SYS-1029TP-DC0R
    SYS-1029TP-DC0R
    SYS-1029TP-DC0R
    SYS-1029TP-DC0R
    SYS-1029TP-DC0R

    SuperServer 1029TP-DTR

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    Арт. SYS-1029TP-DC0R

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    Технические характеристики
    PC Health Monitoring - FAN Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
    PC Health Monitoring - Temperature Monitoring for CPU and chassis environment Thermal Control for fan connectors
    Chassis - Form Factor 1U Rackmount
    Chassis - Model CSE-809H-R1K05P3
    Dimensions and Weight - Height 1.7" (43mm)
    Dimensions and Weight - Width 17.2" (437mm)
    Dimensions and Weight - Depth 28.25" (718mm)
    Dimensions and Weight - Package 29.6" (W) x 8" (H) x 38.4" (L)
    Dimensions and Weight - Weight Gross Weight: 48.1 lbs (21.9 kg) Net Weight: 33.5 lbs (15.2 kg)
    Front Panel - Buttons Power On/Off button UID button
    Front Panel - LEDs Power status LED HDD activity LED Network activity LEDs Universal Information (UID) LED
    Backplane SAS3 backplane; SAS3 backplane; SAS3 backplane; SAS3 backplane
    System Cooling - Fans 3 Heavy duty counter rotating fans with air shroud and optimal fan speed control
    System BIOS - BIOS Type AMI 32MB SPI Flash ROM
    Parts List - Items Included Part Number; Description; Motherboard / Chassis; MBD-X11DPT-PS CSE-809H-R1K05P3; Super X11DPT-PS Motherboards 1U Chassis; Backplane; BPN-ADP-S3008L-L6IP; LSI 3008, SAS 12Gbs (X6 port inside); Backplane; BPN-SAS3-809H; 8-port 1U TwinPro SAS3 12Gbps (4 drives per node) backplane, support up to 8x 2.5-inch SAS3/SATA3 HDD/SSD; Cable 1; CBL-PWCD-0900; PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG; Manual; MNL-2112-QRG; 1029TP-DTR/DC0R/DC1R Quick Reference Guide; Riser Card; RSC-P-6; RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS; Riser Card; RSC-R1UTP-E16R; 1U RHS TwinPro Riser card with one PCI-E x16 slot; Heatsink / Retention; SNK-P0067PS; 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Heatsink / Retention; SNK-P0067PSM; 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Power Supply; PWS-1K05A-1R; 1U 1000W Redundant Power Supply Titanium, 38X40X360mm length; Part Number; Description; Motherboard / Chassis; MBD-X11DPT-PS CSE-809H-R1K05P3; Super X11DPT-PS Motherboards 1U Chassis; Backplane; BPN-ADP-S3008L-L6IP; LSI 3008, SAS 12Gbs (X6 port inside); Backplane; BPN-SAS3-809H; 8-port 1U TwinPro SAS3 12Gbps (4 drives per node) backplane, support up to 8x 2.5-inch SAS3/SATA3 HDD/SSD; Cable 1; CBL-PWCD-0900; PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG; Manual; MNL-2112-QRG; 1029TP-DTR/DC0R/DC1R Quick Reference Guide; Riser Card; RSC-P-6; RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS; Riser Card; RSC-R1UTP-E16R; 1U RHS TwinPro Riser card with one PCI-E x16 slot; Heatsink / Retention; SNK-P0067PS; 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Heatsink / Retention; SNK-P0067PSM; 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Power Supply; PWS-1K05A-1R; 1U 1000W Redundant Power Supply Titanium, 38X40X360mm length; Part Number; Description; Motherboard / Chassis; MBD-X11DPT-PS CSE-809H-R1K05P3; Super X11DPT-PS Motherboards 1U Chassis; Backplane; BPN-ADP-S3008L-L6IP; LSI 3008, SAS 12Gbs (X6 port inside); Backplane; BPN-SAS3-809H; 8-port 1U TwinPro SAS3 12Gbps (4 drives per node) backplane, support up to 8x 2.5-inch SAS3/SATA3 HDD/SSD; Cable 1; CBL-PWCD-0900; PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG; Manual; MNL-2112-QRG; 1029TP-DTR/DC0R/DC1R Quick Reference Guide; Riser Card; RSC-P-6; RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS; Riser Card; RSC-R1UTP-E16R; 1U RHS TwinPro Riser card with one PCI-E x16 slot; Heatsink / Retention; SNK-P0067PS; 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Heatsink / Retention; SNK-P0067PSM; 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Power Supply; PWS-1K05A-1R; 1U 1000W Redundant Power Supply Titanium, 38X40X360mm length; Part Number; Description; Motherboard / Chassis; MBD-X11DPT-PS CSE-809H-R1K05P3; Super X11DPT-PS Motherboards 1U Chassis; Backplane; BPN-ADP-S3008L-L6IP; LSI 3008, SAS 12Gbs (X6 port inside); Backplane; BPN-SAS3-809H; 8-port 1U TwinPro SAS3 12Gbps (4 drives per node) backplane, support up to 8x 2.5-inch SAS3/SATA3 HDD/SSD; Cable 1; CBL-PWCD-0900; PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG; Manual; MNL-2112-QRG; 1029TP-DTR/DC0R/DC1R Quick Reference Guide; Riser Card; RSC-P-6; RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS; Riser Card; RSC-R1UTP-E16R; 1U RHS TwinPro Riser card with one PCI-E x16 slot; Heatsink / Retention; SNK-P0067PS; 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Heatsink / Retention; SNK-P0067PSM; 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism; Power Supply; PWS-1K05A-1R; 1U 1000W Redundant Power Supply Titanium, 38X40X360mm length
    Optional Parts List Part Number; Description; TPM security module (optional, not included); AOM-TPM-9670V; SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor; TPM security module (optional, not included); AOM-TPM-9671V; SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor; Carrier Card; AOC-SMG3-2H8M2; AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), FST-SCRW-0121L is included in AOC-SMG3-2H8M2; Global Services & Support; OS4HR3/2/1 OSNBD3/2/1; 3/2/1-year onsite 24x7x4 service 3/2/1-year onsite NBD service; Software; SFT-OOB-LIC •; OOB Management Package (per node license); Software; SFT-DCMS-Single; DataCenter Management Package (per node license); Part Number; Description; TPM security module (optional, not included); AOM-TPM-9670V; SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor; TPM security module (optional, not included); AOM-TPM-9671V; SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor; Carrier Card; AOC-SMG3-2H8M2; AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), FST-SCRW-0121L is included in AOC-SMG3-2H8M2; Global Services & Support; OS4HR3/2/1 OSNBD3/2/1; 3/2/1-year onsite 24x7x4 service 3/2/1-year onsite NBD service; Software; SFT-OOB-LIC •; OOB Management Package (per node license); Software; SFT-DCMS-Single; DataCenter Management Package (per node license); Part Number; Description; TPM security module (optional, not included); AOM-TPM-9670V; SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor; TPM security module (optional, not included); AOM-TPM-9671V; SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor; Carrier Card; AOC-SMG3-2H8M2; AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), FST-SCRW-0121L is included in AOC-SMG3-2H8M2; Global Services & Support; OS4HR3/2/1 OSNBD3/2/1; 3/2/1-year onsite 24x7x4 service 3/2/1-year onsite NBD service; Software; SFT-OOB-LIC •; OOB Management Package (per node license); Software; SFT-DCMS-Single; DataCenter Management Package (per node license); Part Number; Description; TPM security module (optional, not included); AOM-TPM-9670V; SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor; TPM security module (optional, not included); AOM-TPM-9671V; SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor; Carrier Card; AOC-SMG3-2H8M2; AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), FST-SCRW-0121L is included in AOC-SMG3-2H8M2; Global Services & Support; OS4HR3/2/1 OSNBD3/2/1; 3/2/1-year onsite 24x7x4 service 3/2/1-year onsite NBD service; Software; SFT-OOB-LIC •; OOB Management Package (per node license); Software; SFT-DCMS-Single; DataCenter Management Package (per node license)
    Management - Software Intel® Node Manager IPMI 2.0 KVM with dedicated LAN NMI SSM , SPM , SUM SuperDoctor® 5 Watchdog
    Management - Power Configurations ACPI Power Management
    PC Health Monitoring - CPU Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
    Operating Environment - RoHS RoHS Compliant
    Operating Environment - Environmental Spec Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
    PowerStick Power Supply 1000W 1U Redundant Power Supplies with PMBus; 1000W 1U Redundant Power Supplies with PMBus; 1000W 1U Redundant Power Supplies with PMBus; 1000W 1U Redundant Power Supplies with PMBus
    PowerStick Power Supply - Total Output Power 800W: 100 – 127Vac 1000W: 200 – 240Vac
    PowerStick Power Supply - DimensionW x H x L 38 x 40 x 360 mm
    PowerStick Power Supply - Input 100-127Vac / 9-7.5A / 50-60Hz 200-240Vac / 6-5A / 50-60Hz
    PowerStick Power Supply - 12V Max: 66.7A / Min: 0A (100-127Vac) Max: 83A / Min: 0A (200-240Vac)
    PowerStick Power Supply - 5Vsb Max: 4A / Min: 0A
    PowerStick Power Supply - Output Type Gold Finger Connector (16 Power Pin, 14 Signal Pin)
    PowerStick Power Supply - Certification Titanium Level [ Test Report ]
    Processor per Node - CPU Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ‡ , Dual UPI up to 10.4GT/s Support CPU TDP 70-145W (Consult with SYS PM for higher CPU TDP Supports)
    Processor per Node - Cores Up to 28 Cores
    Processor per Node - Note ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
    System Memory per Node - Memory Capacity 16 DIMM slots Up to 4TB 3DS ECC DDR4-2933MHz † RDIMM/LRDIMM
    System Memory per Node - Memory Type 2933 † /2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
    System Memory per Node - Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
    Input Output per Node - LAN 1 RJ45 Dedicated IPMI LAN port
    Input Output per Node - USB 2 USB 3.0 ports (rear)
    Input Output per Node - Others 2 SuperDOM support on the motherboard 1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2 M.2 and SuperDOM are for OS boot and they cannot coexist
    Expansion Slots per Node - PCI-Express 2 PCI-E 3.0 x16 Low-profile slots 1 SIOM card support Note: Barebones and Complete System must bundle with SIOM (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
    Drive Bays per Node - Hot-swap 4 Hot-swap 2.5" SAS3/SATA3 drive bays
    On-Board Devices per Node - Chipset Intel® C621 chipset
    On-Board Devices per Node - Network Controllers Barebones and Complete System must have at least one SIOM card installed per node
    On-Board Devices per Node - IPMI Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    On-Board Devices per Node - Graphics ASPEED AST2500 BMC
    Input Output per Node - VGA 1 VGA port
    Input Output per Node - Serial Port Header 1 Fast UART 16550 port / 1 Header (internal)
    On-Board Devices per Node - SAS Broadcom 3008 SAS3 (12Gbps) controller; SW RAID 0, 1, 10 support
    Input Output per Node - SAS 4 SAS3 (12Gbps) ports
    Motherboard Two per System Super X11DPT-PS; Super X11DPT-PS; Super X11DPT-PS; Super X11DPT-PS
    Product SKUs - SYS-1029TP-DC0R SuperServer 1029TP-DC0R ( Black )
    MNL-2112
    21,1 Мб
    datasheet_H12_2U2NodeGPU
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